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CM1400-03 6 Channel EMI Filter Array with ESD Protection
Features
* * * * * * * * * * * Functionally and pin compatible with CSPEMI306A device OptiGuardTM coated for improved reliability at assembly Six channels of EMI filtering for data ports Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network 40dB absolute attenuation (typical) at 1 GHz 35dB attenuation (typical) at 1 GHz relative to pass band 15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) 30kV ESD protection on each channel (HBM) 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Lead-free version available
Product Description
The CM1400-03 is a six channel low-pass filter array that reduces EMI/RFI emissions while at the same time providing ESD protection. It is used on data ports on mobile devices. To reduce EMI/RFI emissions, the CM1400-03 integrates a pi-style filter (C-R-C) for each of the 6 channels. Each high quality filter provides greater than 30dB attenuation in the 800-2700 MHz range relative to the pass band attenuation. These pistyle filters also support bidirectional filtering, controlling EMI both to and from a data port connector. In addition, the CM1400-03 provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of 15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 30kV. The CM1400-03 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CM1400-03 incorporates OptiGuardTM coating which results in improved reliability at assembly. The CM1400-03 is available in a space-saving, low-profile chip scale package with optional lead-free finishing.
Applications
* * * * * * EMI filtering and ESD protection for both data and I/O ports Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs
Electrical Schematic
100 FILTERn* 30pF 30pF FILTERn*
GND (Pins B1-B3)
1 of 6 EMI/RFI + ESD Channels
* See Package/Pinout Diagram for expanded pin information.
(c) 2005 California Micro Devices Corp. All rights reserved. 10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
1
CM1400-03
PACKAGE / PINOUT DIAGRAMS (Bumps Down View)
Orientation Marking (see note 2)
TOP VIEW
BOTTOM VIEW
(Bumps Up View)
FILTER3 FILTER4
1 A B C
2
3
4
5
6
FILTER1 FILTER2 FILTER5 FILTER6
C1
GND
C2 B1
C3
GND
C4 B2
C5
GND
C6 B3
N003
Orientation Marking
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
A1
A1
A2
A3
A4
A5
A6
Notes: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
CM1400-03CS/CP
PIN DESCRIPTIONS
PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 C1 C2 C3 C4 C5 C6 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 GND FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Device Ground Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Pins 15 Package CSP Ordering Part Number1 CM1400-03CS Part Marking N003 Lead-free Finish2 Ordering Part Number1 CM1400-03CP Part Marking N003
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
10/04/05
CM1400-03
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 600 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
SYMBOL R C TCR TCC VDIODE ILEAK VSIG PARAMETER Resistance Capacitance Temperature Coefficient of Resistance Temperature Coefficient of Capacitance Diode Voltage (reverse bias) Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off Frequency ZSOURCE=50, ZLOAD=50 At 2.5V DC IDIODE=10A VDIODE=3.3V ILOAD = 10mA 5.6 -1.5 30 15 Notes 2, 3 and 4 +10 -5 R=100, C=30pF 58 MHz V V 6.8 -0.8 At 2.5V DC CONDITIONS MIN 80 24 TYP 100 30 1200 -300 6.0 100 9.0 -0.4 MAX 120 36 UNITS pF ppm/C ppm/C V nA V V kV kV
VESD
Notes 2 and 4
VCL
fC
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: These parameters are guaranteed by design and characterization.
(c) 2005 California Micro Devices Corp. All rights reserved. 10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
3
CM1400-03
Performance Information
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B2)
(c) 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
10/04/05
CM1400-03
Performance Information (cont'd)
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)
(c) 2005 California Micro Devices Corp. All rights reserved. 10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
5
CM1400-03
Performance Information (cont'd)
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B2)
Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B2)
(c) 2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
10/04/05
CM1400-03
Performance Information (cont'd)
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 7. Comparison of Filter Response Curves for CM1400-03 with DC Bias
(c) 2005 California Micro Devices Corp. All rights reserved. 10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
7
CM1400-03
Performance Information (cont'd)
1.6
1.5
1.4
Normalized Capacitance
1.3
1.2
T = -40C T = +25C T = +70C
1.1
1.0
0.9
0.8
0.7 0 1 2 3 4 5
DC Input Voltage (V)
Figure 8. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25C)
1.100 1.080 1.060
Nornalized Resistance
1.040 1.020 1.000 0.980 0.960 0.940 0.920 0.900 -40 -20 0 20 40 60 80 100 Temperature ['C]
Figure 9. Resistance vs. Temperature (normalized to resistance at 25C)
(c) 2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
10/04/05
CM1400-03
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste
Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA.
VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 240C 260C
Figure 10. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 11. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2005 California Micro Devices Corp. All rights reserved. 10/04/05
Figure 12. Lead-free (SnAgCu) Solder Ball Reflow Profile
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
9
CM1400-03
Mechanical Details
CSP Mechanical Specifications The CM1400-03 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams
BOTTOM VIEW
A1
OptiGuardTM Coating
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 15 Inches Nom Max
C1
B1 C B A 1 2 3 4
B2 B4 B3 A2 C2
5
6 D1 D2
2.915 2.960 3.005 0.1148 0.1165 0.1183 1.285 1.330 1.375 0.0506 0.0524 0.0541 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
SIDE VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1400-03 Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER CM1400-03 CHIP SIZE (mm) 2.96 X 1.33 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 3.10 X 1.45 X 0.74
Po Top Cover Tape
TAPE WIDTH W 8mm
REEL DIAMETER 178mm (7")
QTY PER REEL 3500
P0 4mm
P1 4mm
10 Pitches Cumulative Tolerance On Tape 0.2 mm
Ao W Bo
Ko
For Tape Feeder Reference Only including Draft. Concentric Around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 13. Tape and Reel Mechanical Data
(c) 2005 California Micro Devices Corp. All rights reserved.
10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
10/04/05

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